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mos integrated circuit pd16312 1/4- to 1/11-duty fip tm (vfd) controller/driver data sheet document no. ic-3307 (1st edition) date published march 1997 p printed in japan 199 3 ? the pd16312 is a fip (fluorescent indicator panel, or vacuum fluorescent display) controller/driver that is driven on a 1/4- to 1/11 duty factor. it consists of 11 segmen t outpu t lines , 6 gri d outpu t lines , 5 segment/gri d output driv e lines , a displa y memory , a contro l circuit, and a key scan circuit. serial data is input to the pd16312 through a three-line serial interface. this fip controller/driver is ideal as a peripheral device for a single-chip microcomputer. features ? multiple display modes (11-segment & 11-digit to 16-segment & 4-digit) ? key scanning (6 4 matrix) ? dimming circuit (eight steps) ? high-voltage output ( v dd 35 v max). ? led ports (4 chs., 20 ma max). ? general-purpose input port (4 bits) ? no external resistors necessary for driver outputs (p-ch open-drain + pull-down resistor output) ? serial interface (clk, stb, d in , d out ) ordering information part number package pd16312gb-3b4 44-pin plastic qfp ( 10)
2 pd16312 block diagram d in d out clk key 1 to key 4 sw 1 to sw 4 stb r 4 4 osc 4-bit latch key data memory (4 6) key data memory (4 6) timing generator key scan display memeory 16 bits 11 words command decoder dimming circuit 4-bit latch 11 6 5 5 5 16 11 seg 1 seg 11 seg 12 /grid 11 seg 16 /grid 7 grid 1 grid 6 11-bit shift register data selector multip lexed diver grid driver seg- ment driver 16-bit output latch serial i/f v dd led 1 led 4 v dd (+5 v) v ss (0 v) v ee ( - 30 v)
3 pd16312 pin configuration (top view) sw 1 1 sw 2 2 sw 3 3 sw 4 4 d out 5 d in 6 v ss 7 clk 8 stb 9 key 1 10 key 2 11 grid 5 33 grid 6 32 seg 16 /grid 7 31 seg 15 /grid 8 30 seg 14 /grid 9 29 seg 13 /grid 10 28 v ee 27 seg 12 /grid 11 26 seg 11 25 seg 10 24 seg 9 23 key 3 12 key 4 13 v dd 14 seg 1 /ks 1 15 seg 2 /ks 2 16 seg 3 /ks 3 17 seg 4 /ks 4 18 seg 5 /ks 5 19 seg 6 /ks 6 20 seg 7 21 seg 8 22 osc 44 v ss 43 led 1 42 led 2 41 led 3 40 led 4 39 v dd 38 grid 1 37 grid 2 36 grid 3 35 grid 4 34 use all power pins.
4 pd16312 pin function symbol pin name pin no description d in data input 6 input serial data at rising edge of shift clock, starting from the low order bit. d out data output 5 output serial data at the falling edge of the shift clock, starting from low order bit. this is n-ch open-drain output pin. stb strobe 9 initializes serial interface at the rising or falling edge of the pd16312. it then waits for reception of a command. data input after stb has fallen is processed as a command. while command data is processed, current processing is stopped, and the serial interface is initialized. while stb is high, clk is ignored. clk clock input 8 reads serial data at the rising edge, and outputs data at the falling edge. osc oscillator pin 44 connect resistor to this pin to determine the oscillation frequency to this pin. seg 1 /ks 1 to seg 6 /ks 6 high-voltage output 15 to 20 segment output pins (dual function as key source) seg 7 to seg 11 high-voltage output (segment) 21 to 25 segment output pins grid 1 to grid 6 high-voltage output (grid) 37 to 32 grid output pins seg 12 /grid 11 to seg 16 /grid 7 high-voltage output (segment/grid) 26, 28 to 31 these pins are selectable for segment or grid driving. led 1 to led 4 led output 42 to 39 cmos output. +20 ma max. key 1 to key 4 key data input 10 to 13 data input to these pins is latched at the end of the display cycle. sw 1 to sw 4 switch input 1 to 4 these pins constitute a 4-bit general-purpose input port. v dd logic power 14, 38 5 v 10 % v ss logic ground 7, 43 connect this pin to system gnd. v ee pull-down level 27 v dd 35 v max.
5 pd16312 display ram address and display mode the display ram stores the data transmitted from an external device to the pd16312 through the serial interface, and is assigned addresses as follows, in 8 bits unit: seg 1 seg 4 seg 8 seg 12 seg 16 00h l 00h u 01h l 01h u dig 1 02h l 02h u 03h l 03h u dig 2 04h l 04h u 05h l 05h u dig 3 06h l 06h u 07h l 07h u dig 4 08h l 08h u 09h l 09h u dig 5 0ah l 0ah u 0bh l 0bh u dig 6 0ch l 0ch u 0dh l 0dh u dig 7 0eh l 0eh u 0fh l 0fh u dig 8 10h l 10h u 11h l 11h u dig 9 12h l 12h u 13h l 13h u dig 10 14h l 14h u 15h l 15h u dig 11 b 0 b 3 b 4 b 7 xxh l xxh u lower 4 bits higher 4 bits
6 pd16312 key matrix and key-input data storage ram the key matrix is made up of a 6 4 matrix, as shown below. key 1 key 2 key 3 key 4 seg 1 /ks 1 seg 2 /ks 2 seg 3 /ks 3 seg 4 /ks 4 seg 5 /ks 5 seg 6 /ks 6 the data of each key is stored as illustrated below, and is read with the read command, starting from the least significant bit. key 1 key 4 key 1 key 4 seg 1 /ks 1 seg 2 /ks 2 seg 3 /ks 3 seg 4 /ks 4 seg 5 /ks 5 seg 6 /ks 6 reading sequence b0------------ b3 b4 ------------b7 led port data is written to the led port with the write command, starting from the least ports least significant bit. when a bit of this port is 0, the corresponding led lights; when the bit is 1, the led truns off. the data of bits 5 through 8 are ignored. msb ---- b3 b2 b1 b0 don't care lsb led1 led2 led3 led4 on power application, all leds are unlit.
7 pd16312 sw data sw data is read with the read command, starting from the least significant bit. bits 5 through 8 of the sw data are 0. msb 0 0 0 0 b3 b2 b1 b0 lsb sw1 sw2 sw3 sw4 commands commands set the display mode and status of the fip driver. the first 1 byte input to the pd16312 through the d in pin after the stb pin has fallen is regarded as a command. if stb is set high while commands/data are transmitted, serial communication is initialized, and the commands/data being transmitted are invalid (however, the commands/data previously transmitted remain valid). (1) display mode setting commands these commands initialize the pd16312 and select the number of segments and the number of grids (1/4 to 1/11 duty, 11 segments to 16 segments). when these commands are executed, the display is forcibly turned off, and key scanning is also stopped. to resume display, the display command on must be executed. if the same mode is selected, however, nothing happens. msb 00 --- b2 b1 b0 irrelevant lsb display mode settings 000 001 010 011 100 101 110 111 : 4 digits, 16 segments : 5 digits, 16 segments : 6 digits, 16 segments : 7 digits, 15 segments : 8 digits, 14 segments : 9 digits, 13 segments : 10 digits, 12 segments : 11 digits, 11 segments on power application, the 11-digit, 11-segment mode is selected.
8 pd16312 (2) data setting commands these commands set data write and data read modes. msb 01 -- b3 b2 b1 b0 irrelevant lsb data write and read mode settings 00 01 10 11 : write data to display memory : write data to led port : read key data : read sw data address increment mode settings (display memory) 0 1 : increments address after data has been written : fixes address. test mode settings 0 1 : normal operation : test mode on power application, the normal operation and address increment modes are set. (3) address setting commands these commands set an address of the display memory. msb 11 - b4 b3 b2 b1 b0 lsb address (00h - 15h) if address 16h or higher is set, data is ignored, until a valid address is set. on power application, the address is set to 00h.
9 pd16312 (4) display control commands msb 10 -- b3 b2 b1 b0 irrelevant lsb dimming quantity settings 000 001 010 011 100 101 110 111 : set pulse width to 1/16. : set pulse width to 2/16. : set pulse width to 4/16. : set pulse width to 10/16. : set pulse width to 11/16. : set pulse width to 12/16. : set pulse width to 13/16. : set pulse width to 14/16. turns on/off display. 0 1 : display off (key scan continues note ) : display on on power application, the 1/16 pulse width is set and the display is turned off. note on power application, key scanning is stopped.
10 pd16312 key scanning and display timing seg output dig1 t disp = 500 s 1 frame = t disp (n + 1) m dig2 dig3 key scan data dign 1 5 6 34 2 dig1 1/16 t disp g 1 g 2 g 3 g n one cycle of key scanning consists of one frame, and data in a 6 4 matrix is stored in ram.
11 pd16312 serial communication format reception (command/data write) stb d in b0 b1 b2 b6 b7 clk 123 78 if data continues transmission (data read) stb d in b0 b1 b2 b3 b4 b5 b0 b1 b2 b3 b4 b5 b6 b7 clk 123456 123456 78 d out a data read command is set. data is read. t wait note because the d out pin is an n-ch, open-drain output pin, be sure to connect an external pull-up resistor to this pin (1 k to 10 k ). note when data is read, a wait time t wait of 1 s is necessary since the rising of the eighth clock that has set the command, until the falling of the first clock that has read the data.
12 pd16312 absolute maximum ratings (t a = 25 c, v ss = 0 v) parameter symbol ratings unit logic supply voltage v dd 0.5 to +7.0 v driver supply voltage v ee v dd +0.5 to v dd 40 v logic input voltage v i1 0.5 to v dd +0.5 v fip driver output voltage v o2 v ee 0.5 to v dd +0.5 v led driver output current i o1 +25 ma fip driver output current i o2 40 (grid) 15 (segment) ma power dissipation p d 800 note mw operating ambient temperature t opt 40 to +85 c storage temperature t stg 65 to +150 c note derate at 6.4 mw/ c at t a = 25 c or higher. recommended operating range (t a = 20 to 70 c, v ss = 0 v) parameter symbol min. typ. max. unit test conditions logic supply voltage v dd 4.5 5 5.5 v high-level input voltage v ih 0.7 v dd v dd v low-level input voltage v il 0 0.3 v dd v driver supply votlage v ee 0v dd 35 v maximum power consumption p max . = fip driver dissipation + r l dissipation + led driver dissipation + dynamic power consumption where segment current = 3 ma, grid current = 15 ma, and led current = 20 ma, fip driver dissipation = number of segments 6 + number of grids/(number of grids + 1) 30 (mw) r l dissipation = (v dd v ee ) 2 /50 (number of segments + 1) (mw) led driver dissipation = number of leds 20 (mw) dynamic power consumption = v dd 5 (mw) example where v ee = 25 v, v dd = 5 v, and in 16-segment and 6-digit modes, fip driver dissipation = 16 6 + 6/7 30 = 122 r l dissipation = 30 2 /50 17 = 306 led driver dissipation = 4 20 = 80 dynamic power consumption = 5 5 = 25 total 553 mw
13 pd16312 electrical characteristics (t a = 20 to +70 c, v dd = 4.5 to 5.5 v, v ss = 0 v, v ee = v dd 35 v) parameter symbol min. typ. max. unit test conditions high-level output voltage v oh1 0.9 v dd v led 1 led 4 , i oh1 = 1 ma low-level output voltage v ol1 1 v led 1 led 4 , i ol1 = 20 ma low-level output voltage v ol2 0.4 v d out , i ol2 = 4 ma high-level output current i oh21 3mav o = v dd 2 v, seg 1 to seg 11 high-level output current i oh22 15 ma v o = v dd 2 v, grid 1 to grid 6 seg 12 / grid 11 to seg 16/ grid 7 driver leakage current i oleak 10 av o = v dd 35 v, driver off output pull-down resistor r l 50 100 150 k driver output input current i i 1 av i = v dd or v ss high-level input voltage v ih 0.7 v dd v low-level input voltage v il 0.3 v dd v hysteresis voltage v h 0.35 v clk, d in , stb dynamic current consumption i dddyn 5 ma under no load, display off switching characteristics (t a = 20 to +70 c, v dd = 4.5 to 5.5 v, v ee = 30 v) parameter symbol min. typ. max. unit test conditions oscillation frequency t osc 350 500 650 khz r = 51 k propagation delay time t plz 300 ns clk d out t pzl 100 ns c l = 15 pf, r l = 10 k rise time t tzh1 2 sc l = 300 pf seg 1 to seg 11 t tzh2 0.5 s grid 1 to grid 6 , seg 12 /grid 11 to seg 16 /grid 7 fall time t thz 120 sc l = 300 pf, seg n , grid n maximum clock frequency f max. 1 mhz duty = 50 % input capacitance c i 15 pf timing conditions (t a = 20 to 70 c, v dd = 4.5 to 5.5 v) parameter symbol min. typ. max. unit test conditions clock pule width pw clk 400 ns strobe pulse width pw stb 1 s data setup time t setup 100 ns data hold time t hold 100 ns clock-strobe time t clk-stb 1 s clk stb wait time t wait 1 s clk clk note note refer to page 11.
14 pd16312 switching characteristic waveforms osc stb 50 % 90 % 10 % f osc pw clk pw clk t clk-stb t setup t hold t pzl t thz t tzh t plz pw stb s n /g n clk d in d out
15 pd16312 applications updating display memory by incrementing address d in command 2 command 3 data 1 data n command 4 command 1 clk stb command 1: sets display mode command 2: sets data command 3: sets address data 1 to n: transfers display data (22 bytes max.) command 4: controls diplay updating specific address d in command 2 data command 2 data command 1 clk stb command 1: sets data command 2: sets address data: display data
16 pd16312 recommended soldering conditions the following conditions (see table below) must be met when soldering this product. please consult with our sales offices in cae other soldering process is used, or in case soldering is done under different conditions. pc16312gb-3b4 soldering process soldering conditions symbol infrared ray reflow peak packages surface temperature: 235 c or below, reflow time: 30 seconds or below (210 c or higher), number of reflow process: 2, exposure limit*: none ir35-00-2 vps peak packages surface temperature: 215 c or below, reflow time: 40 seconds or below (200 c or higher), number of reflow process: 2, exposure limit*: none vp15-00-2 wave soldering solder temperature: 260 c or below, flow time: 10 seconds or below number of flow process: 1, exposure limit*: none ws60-00-1 partial heating method terminal temperature: 300 c or below, flow time 10 seconds or below, exposure limit*: none * exposure limit before soldering after dry-pack package is opened. storage conditions: 25 c and relative humidity at 65 % or less. note do not apply more than a single process at once, except for partial heating method.
17 p p p p pd16312 44 pin plastic qfp ( 10) note each lead centerline is located within 0.15 mm (0.006 inch) of its true position (t.p.) at maximum material condition. p44gb-80-3b4-3 item millimeters inches a b c 13.6?.4 10.0?.2 10.0?.2 0.535 0.394 0.394 d 13.6?.4 0.535 f 1.0 0.039 g 1.0 0.039 h 0.35?.10 0.014 i 0.15 0.006 j 0.8 (t.p.) 0.031 (t.p) k 1.8?.2 0.071 l 0.8?.2 0.031 m 0.15 0.006 n 0.10 0.004 p 2.7 0.106 q 0.1?.1 0.004?.004 r 5??? 5??? s 3.0 max. 0.119 max. +0.017 ?.016 +0.008 ?.009 +0.008 ?.009 +0.017 ?.016 +0.004 ?.005 +0.008 ?.009 +0.009 ?.008 +0.004 ?.003 n l detail of lead end g m i j h a f m q r b 33 34 22 44 1 12 11 23 c d s p k +0.10 ?.05
18 pd16312 [memo]
19 pd16312 [memo]
pd16312 fip tm is a trademark of nec corporation. no part of this document may be copied or reproduced in any form or by any means without the prior written consent of nec corporation. nec corporation assumes no responsibility for any errors which may appear in this document. nec corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. no license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of nec corporation or others. while nec corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. to minimize risks of damage or injury to persons or property arising from a defect in an nec semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. nec devices are classified into the following three quality grades: "standard", "special", and "specific". the specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. the recommended applications of a device depend on its quality grade, as indicated below. customers must check the quality grade of each device before using it in a particular application. standard: computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots special: transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) specific: aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. the quality grade of nec devices is "standard" unless otherwise specified in nec's data sheets or data books. if customers intend to use nec devices for applications other than those specified for standard quality grade, they should contact an nec sales representative in advance. anti-radioactive design is not implemented in this product. m4 96. 5

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